JPS6254582B2 - - Google Patents

Info

Publication number
JPS6254582B2
JPS6254582B2 JP7609684A JP7609684A JPS6254582B2 JP S6254582 B2 JPS6254582 B2 JP S6254582B2 JP 7609684 A JP7609684 A JP 7609684A JP 7609684 A JP7609684 A JP 7609684A JP S6254582 B2 JPS6254582 B2 JP S6254582B2
Authority
JP
Japan
Prior art keywords
flux
printed wiring
wiring board
coating device
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7609684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59209474A (ja
Inventor
Kyoshi Shirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7609684A priority Critical patent/JPS59209474A/ja
Publication of JPS59209474A publication Critical patent/JPS59209474A/ja
Publication of JPS6254582B2 publication Critical patent/JPS6254582B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP7609684A 1984-04-16 1984-04-16 自動半田付装置 Granted JPS59209474A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7609684A JPS59209474A (ja) 1984-04-16 1984-04-16 自動半田付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7609684A JPS59209474A (ja) 1984-04-16 1984-04-16 自動半田付装置

Publications (2)

Publication Number Publication Date
JPS59209474A JPS59209474A (ja) 1984-11-28
JPS6254582B2 true JPS6254582B2 (en]) 1987-11-16

Family

ID=13595318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7609684A Granted JPS59209474A (ja) 1984-04-16 1984-04-16 自動半田付装置

Country Status (1)

Country Link
JP (1) JPS59209474A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63168273A (ja) * 1986-12-29 1988-07-12 Tamura Seisakusho Co Ltd 自動はんだ付け装置
JP2509931B2 (ja) * 1987-03-30 1996-06-26 株式会社 タムラ製作所 噴流式はんだ付け装置
US6257480B1 (en) 1998-07-07 2001-07-10 Denso Corporation Jet soldering method and apparatus
JP2009285719A (ja) * 2008-05-30 2009-12-10 Nippon Dennetsu Co Ltd フラックス塗布装置

Also Published As

Publication number Publication date
JPS59209474A (ja) 1984-11-28

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